The impee-fcc003 design is a minimal PCB design for use in wireless certification testing for imp003. Power is provided via an FTDI USB-to-Serial Cable, which is also used to send commands from the RF test utility on a PC to an imp running RF test software.
For access the RF test utility, to order imp003 modules loaded with RF test software, or for any other wireless certification testing questions, please contact us.
Two BoM variants are included in this design; one for 1.6mm PCB thickness, and one for 1.0mm PCB thickness. Designs using the same layer stack, matching components, and antenna design as the 1.6mm PCB design may be able to use Electric Imp's modular certification for FCC testing in the United States. This will not be possible for designs based on the 1.0mm PCB thickness.
The layer stackup used in the 1.6mm PCB design is based on the standard 1.6mm layer stack used by Elecrow. Note that the layer stack in the Altium source files provided is not affected by the selected BOM variant; verify that your layer stack is configured properly before re-using the source files by opening the layer stack manager in the Altium PCB Editor.